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HTC desire S. desire 2.0?
Foreword
The disappointment was quite noticeable: while many manufacturers in mid-February used the prominent platform of Mobile World Congress 2011 (MWC) this new, present on dual-core processors and Smartphones company 3D displays, the floating currently on a wave of success company HTC with three presented two rudimentary “social network” revised old acquaintances,-phones and a first tablet a lineup that knew to shine more with...
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IBM: with tree structures against heat issues
On the BroadGroup power and cooling Summit 2006, researchers at IBM have unveiled a new, innovative approach to improve the cooling of computer chips. The new procedure, called “high thermal conductivity interface technology”, allows a dual improvement in heat dissipation on current procedures.
The researchers have now developed a heat spreader with a network of branching tree-like channels on their surface. The pattern is...
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